RO4730G3 2-Layer 20mil ENIG PCB for Base Station Antennas
1.Introduction
Rogers RO4730G3 is hydrocarbon/ceramic/woven glass UL 94 V-0 antenna grade laminates that are a reliable, low-cost alternative to conventional PTFE-based laminates. The resin systems of RO4730G3 dielectric materials provide the necessary properties for ideal antenna performance. RO4730G3 antenna grade laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. These materials do not require the special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. RO4730G3 laminates are an affordable alternative to conventional PTFE-based antenna materials, allowing designers to optimize cost and performance.
2.Key Features
Stable Dielectric Constant: 3.0 ±0.05 at 10GHz
Loss Characteristics: Dissipation factor of 0.0028 at 10GHz
Thermal Stability: Thermal coefficient of Dk of 34 ppm/°C
Excellent CTE Match: Coefficient of thermal expansion matched to copper
High Temperature Resistance: Tg >280°C, Td of 411°C
Dimensional Stability: CTE x/y/z: 15.9 ppm/°C, 14.4 ppm/°C, 35.2 ppm/°C
Thermal Management: Thermal conductivity of 0.45W/mk
3.Benefits
Superior RF Performance: Low loss dielectric with low profile foil, reduced PIM, low insertion loss
Lightweight Design: Unique filler/closed microspheres, 30% lighter than PTFE/Glass
Enhanced Reliability: Low Z-axis CTE <30ppm/°C, High Tg >280°C
Design Flexibility: Automated assembly compatible, consistent circuit performance
Manufacturing Advantages: Ease of fabrication, PTH process capability
Environmental Compliance: Lead-free process compatibility, RoHS compliant
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RO4730G3 |
| Layer Count | 2 layers |
| Board Dimensions | 59.6mm × 40.5mm = 1PC, ±0.15mm |
| Minimum Trace/Space | 5/5 mils |
| Minimum Hole Size | 0.4mm |
| Blind Vias | No |
| Finished Board Thickness | 0.6mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper_layer_1 - 35 μm
Rogers RO4730G3 Core - 0.508 mm (20mil)
Copper_layer_2 - 35 μm
6.PCB Statistics:
Components: 41
Total Pads: 88
Thru Hole Pads: 61
Top SMT Pads: 27
Bottom SMT Pads: 0
Vias: 97
Nets: 2
7.Typical Applications
Cellular Base Station Antennas
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
